The microchip power supply is the latest generation of modular power supplies based on the revolutionary module-level semiconductor packaging process, using advanced MHz soft switching topology, patented control strategy and dedicated chips to achieve low thermal resistance, double-sided efficient heat dissipation, high integration, lightweight and miniaturization of module power supplies. Compared with the traditional module power supply, the power density is increased by 10 times, the weight is reduced by 90%, and the height is reduced by 50%, which is especially suitable for highly reliable electronic systems with extremely strict requirements on power, efficiency, volume, weight and thickness, such as missile, spaceborne, UAV, TR components and data centers. Performance indicators reach the international advanced level, and Pin-To-Pin compatible with similar competitors.